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Metal etching processing service Product List

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[Circuit Board Manufacturing Example] Curved Printing

[Circuit Board Manufacturing Example] Curved Printing

Challenge in circuit formation on difficult-to-mass-produce irregular substrates and special materials! Respond quickly to mass production.

This is a manufacturing example of high-precision curved surface printing on cylindrical substrate surfaces. Our company utilizes screen printing technology to challenge circuit formation on irregular substrates and special materials, which are difficult to automate and mass-produce. We respond quickly from prototyping to mass production with reliable domestic production, including photo etching, metal etching, circuit boards, and photomasks. 【Case Overview】 ■Material: Glass tube ■Substrate size: φ26mm×150mm ■Film specification: Ag ■Film thickness: 70um *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Printing/Publishing
  • Metal etching processing service

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【Circuit Board Manufacturing Example】Dimple Formation + Patterning Process

【Circuit Board Manufacturing Example】Dimple Formation + Patterning Process

Can be formed on both the base material and the metallized part! We can accommodate various shapes according to your needs.

This is an introduction to a manufacturing case where depressions were formed on the substrate surface. By combining photolithography and sandblasting, high-precision, fine-pitch depression formation is possible. Depressions can be formed on both the base material and the metallized areas, accommodating various shapes according to applications such as preventing adhesive flow during assembly and positioning of components. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride, Quartz Glass ■ Product Size: □5.0mm ■ Conductor Film: Ti/Pd/Au ■ Depression Processing: Depth 0.1mm, Width 0.1mm～ *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Metal etching processing service

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[Manufacturing Example] CCMT for Double-Sided Machining

[Manufacturing Example] CCMT for Double-Sided Machining

By eliminating the base plate, it is possible to access both the surface and the underside of the workpiece simultaneously!

We would like to introduce a manufacturing example of CCMT for double-sided processing. Unlike conventional CCMT, by eliminating the base plate, it is possible to access both the front and back surfaces of the workpiece simultaneously. Tasks such as printing, film formation, and inspection can be carried out on both sides at the same time. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Metal etching processing service

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[Circuit Board Manufacturing Case] Fine Patterning by Direct Drawing

[Circuit Board Manufacturing Case] Fine Patterning by Direct Drawing

We were able to create fine patterns at the "L/S=5μm" level, which cannot be produced with conventional patterning!

This is a manufacturing case of internal collaboration between the circuit board business and the photomask business. In normal patterning, photomasks are used for patterning, but this time, we directly patterned on the substrate coated with photoresist using a drawing device that draws the photomask, exposing it to light for patterning. As a result, we were able to create fine patterns at the "L/S=5μm" level, which are impossible to achieve with normal patterning. [Case Overview] ■ L/S: Targeting 5μm → L=4.7μm/S=5.1μm ■ Film Specifications: From the base layer Cu 2μm/Ni 0.5μm/Au 1μm (Total thickness 3.5μm) *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Metal etching processing service

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